Minutes, IBIS Quality Committee

20 May 2008

11-12 AM EST (8-9 AM PST)

ROLL CALL
  Adam Tambone
* Anders Ekholm, Ericsson
  Barry Katz, SiSoft
  Benny Lazer
  Benjamin P Silva
  Bob Cox, Micron
* Bob Ross, Teraspeed Consulting Group
  Brian Arsenault
* David Banas, Xilinx
* Eckhard Lenski, Nokia Siemens Networks
  Eric Brock
* Guan Tao, Huawei Technologies
  Gregory R Edlund
  Hazem Hegazy
  Huang Chunxing, Huawei Technologies
  John Figueroa
  John Angulo, Mentor Graphics
  Katja Koller, Nokia Siemens Networks
  Kevin Fisher
  Kim Helliwell, LSI Logic
  Lance Wang, IOMethodology
  Lynne Green
* Mike LaBonte, Cisco Systems
  Mike Mayer, SiSoft
* Moshiul Haque, Micron Technology
  Peter LaFlamme
  Randy Wolff, Micron Technology
  Radovan Vuletic, Qimonda
  Robert Haller, Enterasys
  Roy Leventhal, Leventhal Design & Communications
  Sherif Hammad, Mentor Graphics
  Todd Westerhoff, SiSoft
  Tom Dagostino, Teraspeed Consulting Group
  Kazuyoshi Shoji, Hitachi
  Sadahiro Nonoyama

Everyone in attendance marked by *

NOTE: "AR" = Action Required.

-----------------------MINUTES ---------------------------
Mike LaBonte conducted the meeting.

Call for patent disclosure:

- No one declared a patent.

AR Review:

- Anders propose BIRD to clarify meaning of Overshoot/Undershoot
  - BIRD 109 is almost done.
  - There was some reflector discussion on this.

New items:

- Mike is writing an article about IBIS quality for the June issue of
  Tim Coyle's XrossTalk online magazine.

- David: as IBISCHK adds checks, we would remove them from the IQ spec:
  - In theory, IQ would go away when IBISCHK is "complete".
  - The IBISCHK source code is not public, it's a black code.
  - It would be good to have public documentation of IBISCHK.
  - Mike: IQ contains checks that require datasheet information
    - Not all IQ checks therefore can be automated.

- Bob: had an AR to look into test load measurement points:
  - Anders had brought this up.
  - New measurement nodes are needed for bench measuring.
  - David: Does the box around the buffer in the [Test Data] diagram
    represent package or die perimeter?
    - Bob: It's the die
  - Bob: The offending word is "pad" in [Test Data] waveform keywords
  - Bob: Also these are not full cycle measurements.
  - Anders: The new ATM interconnect proposal might provide a better
    test fixture description language.
  - David: The measurement point parameter should be kept with wave data
    - Anders: Test points could be anywhere in the circuit
  - Bob: The current test load structure is very specific
    - It is just a template
  - David: Adding 2 new keywords would not change the circuit template:
    - NEAR_DIE, NEAR_PIN
    - Mike: The diagram uses "s" for silicon, "p" for package
  - Anders: Which waveforms should be required?
  - Anders: New keywords could be like: [Falling Waveform Far Pin]
    - We would have to change the diagram plus descriptive text.
  - Moshiul: This is for correlation purposes.
    - If we add more nodes the data may become huge
    - David: But the waveforms are not required.
  - Bob: IBIS specifically says:
  "The Golden Waveforms must be generated using unpackaged driver and receiver models."
  - Mike: Who is prepared to generate bench measured Golden Waveformss?
    - Bob: It's not that easy

AR: Bob look into test load measurement points BIRD

Next meeting:

27 May 2008 11-12 AM EST (8-9 AM PST)

Meeting ended at 01:07 PM Eastern Time.